|
|
|
Resistance and Laser Welding, Reflow Soldering, Heat Seal Connection Equipment. Wire Bond Pull Testers for Microelectronics Industry.
|
|
System Solutions for Resistance and Laser Welding, Reflow Soldering, Heat Seal Connection, Wire Bonders and Pull Testers.
|
|
Systems And Enclosures For Hermetic Package Sealing: Projection Welding Systems, Parallel Seam Sealing Systems, Tacking Systems and
Atmospheric Enclosures
|
|
Ultrasonic Plastic Assembly Equipment.
|
|
High Velocity Convection Reflow Soldering Systems, and Flip Chip, BGA, Fine Pitch Reflow/Rework Systems.
|
|
Microelectronics, Biomedical and Pharmaceutical Production and Testing Equipment, Clean Room Equipment and Consumables, General Laboratory Equipment
|
|
Radio Frequency (RF) Shielded Enclosures and Anechoic Rooms. Electromagnetic Compatibility (EMC) Applications and Shielding of Medical Equipment Rooms.
Click here for pages in Turkish.
|
|
EMC - Electromagnetic Compatibility - Testing and Calibration Systems
|