Bonding Heads

AMADA WELD TECH offers a full range of bonding heads which are available for the Hot Bar product line. The bonding heads can be used for Hot Bar reflow soldering, ACF-Laminating, Heat Seal Bonding and Heat Staking. The bonding heads offer maximum productivity and consistent process control. The designs are modular, compact, rigid and easily adjustable.

This modular approach enables easy upgrade or system reconfiguration when needed. The compact unit minimises space requirements. The robust bonding heads offer the highest connection accuracy for fine-pitch applications and long thermode lengths at the highest bonding forces.

To achieve optimum force accuracy and consistency, the bonding heads are available in both pneumatic and motorized types and offer a complete bonding force range from 8 to 2500 N.

Key Features:

• Force-fired sensor for accurate force control and consistent
  process stability
• Optional integrated force load cell and displacement sensor for
  additional control and process data traceability

• Integrated mechanical module for planarity adjustment
• Rigid design for maximum productivity and highest possible
  connection accuracy
• Modular design for optimum system integration.