ESEN ELEKTRONÄ°K LTD.
Home >> Manufacturing Equipment >> ACA / Heat Sealing >> Desktop ACF/Heat Sealing >> DT-440-PH & DT-450-PH Uni-Turn (ACF/HSC)
Turkce
DT-440-PH & DT-450-PH Uni-Turn (ACF/HSC)
Uni-Turn systems with automatic rotary table

DT-450-PH Uni-Turn system

ACF Laminator Module

Interposer Module

Product Jig
The Desktop DT-440-PH and DT-450-PH Uni-Turn Systems are part of a line of (semi-) automatic systems developed for ACF/Heat-Seal Bonding. The model "440" has a manually operated rotary-table. The model "450" has an automatically operated 2-position turn - table. The Desktop Series delivers the same high connection quality as the larger and more sophisticated systems. It offers an ideal price – performance (throughput) ratio. The turntable enables easy loading and unloading of the parts, directly in front of the operator. If the parts need to be aligned, it can be done in the front position where the operator or camera have sufficient free space and a view that isn't blocked by the bonding head. The manual model "440"has the same high quality rotary table as the model "450", but with a user-friendly large handle for the rotary movement. The automatic turn-table is the model with the highest throughput (simultaneous loading / unloading and bonding) and the most controlled process (all parts movements are done automatically). The model "450" combines this with the highest user-friendliness: the operator can load the parts straight in front of him while the bonding operation (in the back side) is taking place.
Options:
ACF Laminator Module
The fully automatic ACF Laminator Module is a reel-to-reel laminator for 2-layer ACF material. The ACF (on reel) is manually loaded to the laminator. The ACF Laminator Module positions the ACF above the exact defined place. The pneumatic bonding head and constant heat tool will press the ACF down, and pre-seal the ACF to the surface using adjustable pressure and programmable time and temperature. After the pre-sealing operation the head is moving to the upper position again and the carrier tape is peeled off. An exact separation of the laminated ACF is created by the cut that previously has been made in the ACF (half cut method).

ACP Dispensing Module
MIYACHI EUROPE developed the ACP Dispensing Module for ACP Bonding Technology, which can be installed on all Miyachi Europe Systems. The ACP Dispensing Module has a linear movement to position the needle valve over the bonding pads. Dispensing position and the amount of ACP material are easily adjustable.

Interposer Module
This module is used to protect the Hot-Bar and the products during the bonding process and also to improve the bond strength. Especially on the PCB side, the interposer module forces the adhesive to fill the gaps between the tracks, which is creating a strong mechanical connection.

Alignment Module
If your parts require a very accurate (fine-pitch) alignment, we recommend to use an Optical Alignment Module. This includes a CCD camera with a special lens, special illumination, monitor and power supplies. The optical system magnifies and displays the track on the monitor. Operator speed and operator accuracy will surely increase.

Product Jig Module
Using the high quality MIYACHI EUROPE product jigs ensures optimum process quality. Product jigs are extremely important because bonding quality is influenced by co-planarity of the jigs, fine-alignment of the parts and materials used for the supporting blocks. We have many years of experience making jigs for a broad range of applications and processes. Ask our sales specialists about these modules.

Desktop Series Datasheet (ca. 100 kB)pdf
Interposer Module Datasheet (ca. 100 kB)pdf
 
© 1997-2021 Esen Elektronik Ltd.
All rights reserved. The reproduction of all the information, articles, pictures or drawings presented in this site is subject to approval of Esen Elektronik Ltd. and/or original manufacturing companies.
ESEN ELEKTRONIK MUH. DAN. SAN. VE TIC. LTD. STI.
Yaylagul Sk. 8/4 A. Ayranci 06540 ANKARA TURKEY
Tel:+90 312 468 8114 Fax:+90 312 468 8115